Ultraviolet Laser Marking Machine:
It has following features: high electrooptical conversion rate, long working time of nonlinear crystal, high stability, high positioning accuracy, ULTRAVIOLET LASER MARKING MACHINE HBS-ZG-3 high operation efficiency, optimized modular design for convenient installation and maintenance. Equipped with two-dimensional automated workstation, it can realize marking continuously in multi-stage or large-size marking. The laser marking line is very fine that suitable for marking with high demand, it’s mainly applied to mark the products such as LCD screen, IC wafer, and IC chips.
UV laser marking machine belongs to the laser marking series and uses 355 nm ultraviolet laser integration. Compared to the infrared laser, the 355 UV focal spot is very small, which greatly reduces the mechanical deformation of the materials and the effect of heat processing. UV laser marking machine is mainly used for hyperfine marking and engraving.The machine is especially suitable for marking of food and pharmaceutical packaging materials, drilling of micro-holes, high-speed marking of glass materials, and complex cutting of silicon wafers etc.
High-energy ultraviolet photons directly destroy many of the molecular bonds on the surface of non-metallic materials, to separate the molecules from the objects. Using this method, not much heat will be produced. This is called cold processing. The UV laser focal spot is small, and the processing is not heat affected. Therefore, the machine is suitable for hyperfine marking and engraving of special materials.
Delivery Time: 5-7 working days after receive the payment.